PCB Chat
PCB Chat 76: David Bernard on X-ray Inspection

PCB Chat 76: David Bernard on X-ray Inspection

April 28, 2021

David Bernard, Ph.D., describes a coming presentation on x-ray inspection, including understanding how the system works, how magnification works, detectors and sensitivity, handling various solder types (hint: it's the material density that matter), and why users should "stop wasting time with things their x-ray cannot do."

Bernard's three-hour webinar, Getting the Best from Your X-Ray Inspection System, takes place May 20. For information, click here: pcb2day.com/webinars.

RM Episode 66: Dr. Ron Lasky and Students

RM Episode 66: Dr. Ron Lasky and Students

April 27, 2021

Dr. Ron Lasky (Professor at Dartmouth College) and three of his students -- Annaka Balch, Nadia Clement, and Raaga Kannan -- talk about the papers they wrote and presented at SMTA's Pan Pacific Microelectronics Symposium in Hawaii in 2020, as well as a new paper to be presented at the same conference in 2022.

Concept to Creation - The Entrepreneurs of the Electronic Assembly Industry

Concept to Creation - The Entrepreneurs of the Electronic Assembly Industry

April 23, 2021

Welcome to Mike Konrad's new podcast is called “Concept to Creation - The Entrepreneurs of the Electronic Assembly Industry.” 

On this podcast, Mike will interview industry founders to talk about the following topics: 

  • Concept 
  • Creation 
  • Execution 
  • Growth 
  • Challenges 
  • Successes / Failures 
  • Motivating Insights

 

 

The first episode features Dr. Bill Cardoso of Creative Electron. Bill earned his AA degree at the age of 13. He went on to earn his BS, MS, and Ph.D. in electrical and computer engineering as well as an MBA in economics, strategic management and entrepreneurship. In 2008, he founded Creative Electron, a manufacturer of x-ray equipment. Bill discusses his journey of concept to creation including his success, failures, and challenges along the way.

Future episodes will air on the first and second Tuesday of each month.

The second episode (airing on May 4) features an interview with the husband and wife team behind Out of the Box Manufacturing, a contract assembler in Renton, WA. They discuss, among other things the challenges of starting a new business one month after they were married in 2008 as well as their strategies for successful growth.

The third episode (airing on May 18) features a conversation with FTC Assemblies (soldering materials manufacturer) founder Mike Scimeca.

The fourth episode features an interview with Kyzen’s Dr. Mike Bixenman and Tom Forsythe.

RM65: Tim O’Neill and Fred Dimock on Voiding, Vacuum Reflow, and Oven Profiling, Part 2

RM65: Tim O’Neill and Fred Dimock on Voiding, Vacuum Reflow, and Oven Profiling, Part 2

April 13, 2021

On part 2 of this series , we dive into oven profiling best practices. In part one, we looked at void mitigation and how vacuum reflow technology can help reduce or eliminate voiding. 

Our guests are Tim O’Neill from AIM Solder and Fred Dimock of BTU. Tim will discuss voiding mitigation from a materials standpoint while Fred will bring cover equipment and profiling strategies.

Tim O'Neill is technical marketing manager for AIM Solder. Operating out of AIM’s US headquarters, Tim is responsible for developing and optimizing product and technical information, collaborating with complementary suppliers and equipment manufacturers and ensuring AIM's products exceed expectations and meet market requirements.

Tim is also a technical writer and presenter for industry trade publications and events. He has coauthored several papers on PCB assembly subjects. Tim is also an IPC-A-610 Certified IPC Specialist.

Fred Dimock is manager of process technology at BTU International and recently started a consulting business, FCD-Global services. Fred holds an associate degree in mechanical design from Wentworth in Boston and a bachelor's degree in ceramic engineering from the State University of New York. He has authored numerous articles on lead-free solder, process control, and the operation of continuous furnaces. His papers have been published in English, Chinese, and German.

He has taught numerous SMTA solder reflow classes and participated in the 5-45 Subcommittee for the development of IPC-7801 Reflow Oven Process Control Standard. Additionally, he wrote the chapter on solder reflow for the Handbook of Electronic Assembly and A Guide to SMTA Certification by Dr. Ron Lasky and Jim Hall.

He received Distinguished Speaker status at SMTA Guadalajara Mexico and is a key presenter for the SMTA Jump Start program for new engineers.

 

Timothy O'Neill is the Technical Marketing Manager for AIM Solder. Operating out of AIM’s U.S. Headquarters, Tim is responsible for developing and optimizing product and technical information, collaborating with complimentary suppliers and equipment manufacturers and ensuring AIM's products exceed expectations and meet market requirements.

Tim is also a technical writer and presenter for industry trade publications and events. He has co-authored several papers on PCB assembly subjects.

 

Tim is also an IPC-A-610 Certified IPC Specialist.

 

Fred Dimock is the Manager of Process Technology at BTU International and recently started a consulting business, FCD-Global services.

 

Fred holds an Associate Degree in Mechanical Design from Wentworth in Boston and a Bachelors Degree in Ceramic Engineering from the State University of New York.

 

Fred has authored numerous articles on lead free solder, process control, and the operation of continuous furnaces. His papers have been published in English, Chinese, and German.

 

He has taught numerous SMTA solder reflow classes and participated in the 5-45 Subcommittee for the development of IPC-7801 Reflow Oven Process Control Standard.

Additionally, he wrote the chapter on solder reflow for the Handbook of Electronic Assembly and A Guide to SMTA Certification by Dr Lasky and Jim Hall.

 

He received Distinguished Speaker status at SMTA Guadalajara Mexico and is a key presenter for the SMTA Jump Start program for new engineers.

 

Tim O’Neill may be contacted here:

toneill@aimsolder.com

 

Fred Dimock may be contacted here:

fdimock@btu.com

 

 

RM 64: Tim O’Neill and Fred Dimock on Voiding, Vacuum Reflow, and Oven Profiling

RM 64: Tim O’Neill and Fred Dimock on Voiding, Vacuum Reflow, and Oven Profiling

April 2, 2021

On this episode, we’ll have a conversation with two industry experts on the subject of solder voiding mitigation and oven profiling, two subjects which influence solder voiding. This will be a two part episode. Here, we dive into void mitigation and how vacuum reflow technology can help reduce or eliminate voiding. Part two (episode 65) will discuss profiling best practices.

Our guests are Tim O’Neill from AIM Solder and Fred Dimock of BTU. Tim will discuss voiding mitigation from a materials standpoint while Fred will bring cover equipment and profiling strategies.

Tim O'Neill is technical marketing manager for AIM Solder. Operating out of AIM’s US headquarters, Tim is responsible for developing and optimizing product and technical information, collaborating with complementary suppliers and equipment manufacturers and ensuring AIM's products exceed expectations and meet market requirements.

Tim is also a technical writer and presenter for industry trade publications and events. He has coauthored several papers on PCB assembly subjects. Tim is also an IPC-A-610 Certified IPC Specialist.

Fred Dimock is manager of process technology at BTU International and recently started a consulting business, FCD-Global services. Fred holds an associate degree in mechanical design from Wentworth in Boston and a bachelor's degree in ceramic engineering from the State University of New York. He has authored numerous articles on lead-free solder, process control, and the operation of continuous furnaces. His papers have been published in English, Chinese, and German.

He has taught numerous SMTA solder reflow classes and participated in the 5-45 Subcommittee for the development of IPC-7801 Reflow Oven Process Control Standard. Additionally, he wrote the chapter on solder reflow for the Handbook of Electronic Assembly and A Guide to SMTA Certification by Dr. Ron Lasky and Jim Hall.

He received Distinguished Speaker status at SMTA Guadalajara Mexico and is a key presenter for the SMTA Jump Start program for new engineers.

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