PCB Chat
The Screw-Ups Episode 3 - Solder Paste Handling

The Screw-Ups Episode 3 - Solder Paste Handling

May 20, 2019

What's the optimal way to handle and store solder paste for electronics assembly? Tim O'Neill of AIM Solder shares advice and tales from the front in the latest edition of The Screw-ups.

 

 

PCB Chat Episode 39: Jim Barry of PCB Technologies

PCB Chat Episode 39: Jim Barry of PCB Technologies

May 16, 2019

Jim Barry is sales & marketing manager and technical liaison at PCB Technologies, a fabricator of rigid, rigid-flex and flex PCBs for high-rel applications. Jim has been in the PCB industry since the 1970s, and has prior experience with flex fabricators like Parlex and Eltek and EMS companies including Bull Technologies. He is one of the presenters at the upcoming SMTA Capital Chapter Technical Day in June. This all-day workshop features three talks on DFM/design for reliability/thermal and RF mitigation concerns. He previews the workshop with PCB Chat host Mike Buetow.

PCB Chat Episode 38: Kent McLeroth of Zuken

PCB Chat Episode 38: Kent McLeroth of Zuken

May 7, 2019

Kent McLeroth has been chief executive of Zuken Americas since 2015. He joined the PCB design software developer in 1995 after more than a decade designing hardware for a major defense contractor, where he was a Zuken customer. He discusses Zuken's growth, strategic acquisitions and outlook with PCB Chat's Mike Buetow.

PCB Chat Episode 37: Kyle Miller of Zuken

PCB Chat Episode 37: Kyle Miller of Zuken

April 30, 2019

Kyle Miller is Zuken's manager of Lightning, Design Force and related routing technology. He has a doctorate in artificial intelligence, and is heading Zuken's efforts into applying AI and machine learning to develop next-generation PCB placement and routing. He speaks with PCB Chat's Mike Buetow from Zuken Innovation World, where he gave a presentation on the progress of AI in ECAD, and why designers shouldn't fear for their jobs.

Reliability Matters: Episode 14 - An Interview with Reliability Expert Fred Schenkelberg

Reliability Matters: Episode 14 - An Interview with Reliability Expert Fred Schenkelberg

April 30, 2019

Fred Schenkelberg is an international authority on reliability engineering. He is the reliability expert at FMS Reliability, a reliability engineering and management consulting firm he founded in 2004. Fred left Hewlett Packard’s Reliability Team where he helped create a culture of reliability across HP to assist other organizations. His passion is working with teams to improve product reliability, customer satisfaction, and efficiencies in product development; and to reduce product risk and warranty costs. Fred has bachelor's of science in physics from the United States Military Academy and a master's of science in statistics from Stanford.

Reliability Matters: Episode 13 - A Conversation with KIC’s MB Allen About Thermal Management and Reliability

Reliability Matters: Episode 13 - A Conversation with KIC’s MB Allen About Thermal Management and Reliability

April 23, 2019
Most of our episodes feature guests representing specific segments of the electronic assembly industry. Today’s episode is no exception. My guest on this episode is MB Allen from KIC. KIC provides thermal profiling hardware and profiler software tools that help define, measure, monitor, and improve thermal processes for electronics manufacturing services. Today, more than ever, thermal management is vital to ensuring a proper reflow or soldering process. There is a direct link between proper reflow profiles and reliability, which makes this topic relevant for any conversation about reliability. 

MB Allen is manager of applications and sales for the Americas and Europe. Formerly a product manager MB coordinated the advancement of new products and features to accommodate customer needs. Her technical expertise, relationships with valued partners and customers, and many years of experience aid in the future development and improvements of her company's product offerings. MB has worked in the electronics industry for 31 years and been associated with KIC for 30 years with both national and international positions.

We discuss thermal management and assembly thermal profiling as a means to better reliability.

PCB Chat Episode 36: Simon Fried of Nano Dimension

PCB Chat Episode 36: Simon Fried of Nano Dimension

April 23, 2019

Simon Fried is president, chief business office and cofounder of Nano Dimension, a leader in additive manufacturing systems. He speaks about creating buried capacitance and Nano Dimension's new process for mounting components to the sides of printed circuit boards with PCB Chat's Mike Buetow.

 

 

 

Reliability Matters: Episode 12 - Female Leaders in Tech Everywhere

Reliability Matters: Episode 12 - Female Leaders in Tech Everywhere

April 19, 2019

An interview with US Ambassadors of FLITE (Female Leaders in Tech Everywhere), Michelle Ogihara and Sherry Stepp on the subject of women in electronics and FLITE's mission to build a platform based on real-life experiences to help raise the visibility of females in technology.

Reliability Matters: Episode 11 — Tips & Tricks for Successfully Cleaning Circuit Assemblies

Reliability Matters: Episode 11 — Tips & Tricks for Successfully Cleaning Circuit Assemblies

April 12, 2019

In the last half of the 20th century, cleaning of circuit assemblies was a standard assembly practice. The abolishment of popular CFC-based cleaning solvents ushered the introduction of "no-clean" assembly processes. For much of the electronic assembly industry, cleaning became nonexistent.

Due to assembly and component miniaturization and the explosion of both IOT and automotive electronics, which places many circuit assemblies into harsh environments, the practice of removing harmful ionic contamination from circuit assemblies has once again become a mainstream practice. Today, the majority of electronic assemblies are cleaned. And, for many assemblers, cleaning is a new process.

This podcast presents modern best-practice cleaning techniques including:

- An historical look back at cleaning

- The reason for cleaning

- Reasons for cleaning no-clean flux residues

- Conventional cleaning technologies

- Estimating throughput capabilities on batch and inline cleaning systems

- Do's and don'ts of cleaning circuit assemblies

- How to choose a cleaning chemical (if needed)

- How to determine the assemblies are clean during the cleaning process

- How to determine the assemblies are clean after the cleaning process

- New IPC Cleanliness assessment standards

- Environmental mitigation techniques

- Calculating the per-assembly cost of cleaning

- Keeping your cleaning machine in top-working order

PCB Chat Episode 35: Brad Griffin on a New PCB 3-D Solver

PCB Chat Episode 35: Brad Griffin on a New PCB 3-D Solver

April 8, 2019

Brad Griffin speaks from CDNLive to PCB Chat host Mike Buetow on the new electromagnetic (EM) simulation tool from Cadence. Brad describes how the Clarity software reads design data from all standard chip, IC package and PCB platforms, integrates with Cadence's platforms, and has won plaudits from key customers for its speed and accuracy.