Recorded conversations and interviews on electronics design and manufacturing with the editors of PCD&F/Circuits Assembly
In this episode, George Milad, national accounts manager of technology at Uyemura and co-chair of the IPC Plating Processes Subcommittee, explains nickel corrosion, how it occurs and new methods of mitigation, and how the IPC-4552 ENIG specification is being revised to reflect new corrosion analysis requirements. Hosted by Mike Buetow.
Greg Smith and Tony Lentz talk with Mike Konrad about stencil design and how to reduce voiding. Voiding is a key concern in specific electronic applications including automotive and LED electronic manufacturing. Greg and Tony published a paper titled "Root Cause Stencil Design for SMT Component Thermal Lands," which is available here: https://tinyurl.com/szx3xt8.
Wally Rhines, CEO emeritus of Mentor and former chairman of the ESD Alliance, reports on the third quarter 2019 EDA market results with PCB Chat host Mike Buetow.
