Chris Nash is product manager for Indium’s PCB assembly solder paste, where works with the R&D team and provides technical advice in the selection, use, and application of solder paste and flux to electronics assembly customers throughout the world. He is also a certified Six Sigma Green Belt from Dartmouth College’s Thayer School of Engineering and a Certified SMT Process Engineer. He talks about solder paste insufficients caused by printing with PCB Chat host Mike Buetow.
In this episode, George Milad, national accounts manager of technology at Uyemura and co-chair of the IPC Plating Processes Subcommittee, explains nickel corrosion, how it occurs and new methods of mitigation, and how the IPC-4552 ENIG specification is being revised to reflect new corrosion analysis requirements. Hosted by Mike Buetow.
Reliability Matters: Episode Episode 32: A Conversation with Greg Smith and Tony Lentz about Stencil Design and Void Reduction
Greg Smith and Tony Lentz talk with Mike Konrad about stencil design and how to reduce voiding. Voiding is a key concern in specific electronic applications including automotive and LED electronic manufacturing. Greg and Tony published a paper titled "Root Cause Stencil Design for SMT Component Thermal Lands," which is available here: https://tinyurl.com/szx3xt8.
Wally Rhines, CEO emeritus of Mentor and former chairman of the ESD Alliance, reports on the third quarter 2019 EDA market results with PCB Chat host Mike Buetow.
Heller Industries CEO David Heller joined the family business in 1987, 27 years after its founding. David shares what reflow ovens were like at the beginning stages of surface mount technology and the numerous technological changes required along the way with Reliability Matters host Mike Konrad.
In the second of this two-part interview, Mike Konrad talks with IPC's Brooke Sandy about the IPC Apex Expo technical program.
In the first of two episodes, Mike Konrad interviews IPC technical program manager Brook Sandy about the upcoming IPC Apex Expo. Episode 27 is all about Apex in general, including the technical sessions and keynote speakers.
Alun Morgan and Mike Konrad talk cars, and the increased reliability expectations associated with their electrical systems. The electronics in modern vehicles provide an unpresented level of safety, not just for the driver, but for those people and objects around the vehicle. Because our cars go in and out of harsh environments, the circuit assemblies within the car are subjected to heat, humidity (and other sources of moisture), which contribute to reliability and therefore safety. They discuss one of the primary failure mechanisms of circuit assemblies, an issue that can affect the operation of the safety systems within the automobile, it’s a real issue that for many is not well known.
According to Puneet Gupta, Ph.D. and his colleagues at UCLA including Subramanian Iyer, Ph.D., the printed circuit board is a constraint on electronics size and speed. And the solution is to get rid of it. The professors have developed a method to replace PCBs with an all-silicon technology, called silicon-interconnect fabric, which allows bare chips to be connected directly to wiring on a separate piece of silicon. The wiring between chips on fabric is at the nanometer scale, much like the wiring within a chip. Dr. Gupta asserts many more chip-to-chip connections are thus possible, and those connections are able to transmit data faster while using less energy. He discusses the technology and its implications with PCB Chat host Mike Buetow.
Indium's Kay Parker discusses SMT solder paste printing and her experience as a new engineer in the electronics assembly industry with Mike Konrad.
Kay is a technical support engineer based at Indium headquarters in Clinton, NY. In this role, she provides guidance and recommendations to customers related to process steps, equipment, techniques, and materials. She is also responsible for servicing the company’s existing accounts and retaining new business. She joined Indium as a college intern. During her internship, she worked alongside process engineers in Indium's Metals and Compounds division. After graduating from the State University of New York Polytechnic Institute in 2018, Kay joined the company as a technical support engineer.
At SUNY Poly, Kay earned a bachelor’s degree in applied mathematics with a minor in engineering science. Her past accomplishments include managing the details of a National Science Foundation grant, forming and leading an award-winning competitive student robotics club, developing industrial manufacturing process technologies, and modeling the flow of blood in the human eye using mathematical equations and computer programs.