PCB Chat
RM 84: Christopher Frederickson on Solder Paste Inspection

RM 84: Christopher Frederickson on Solder Paste Inspection

December 16, 2021

Today, we discuss Fit for Use solder paste inspection. As we've repeated several times on this show, it is said most reliability problems begin at the printer. Our industry utilizes a lot of materials in order to produce a circuit assembly. If the materials, specifically the solder paste is out of spec, that can affect reliability. Unfortunately, in most cases, one cannot simply open a jar of solder paste and easily determine visually if the solder paste their applying to the stencil is fit for use, or if it has gone bad, or is out of spec.

Mike Konrad's guest will discuss what solder paste fit for use means, and how we can provide methods for determining its fit for use right on the production floor. On a completely unrelated topic, but maybe even more interesting, he also has experience in wearable electronics in temporary tattoos. You bet we ask him about that!

 

PCB Chat 89: College Training Programs for Electronics

PCB Chat 89: College Training Programs for Electronics

December 10, 2021

Lorain County Community College, located in northeast Ohio, about 30 miles west of Cleveland, became in 2018 the first community college to offer an applied bachelor’s in microelectronic manufacturing. And a year ago, it formed the Manufacturing Electronics & Rework Institute for Training, or MERIT, which the hands-on training lab. Last spring, the program graduated its first students.

Johnny Vanderford, the director of MERIT and an assistant professor of MEMS at LCCC, and Courtney Tenhover, program developer, Engineering, Business, and Information Technologies, join Mike Buetow to discuss how industry companies shape the program curriculum and its potential for adoption by other colleges.

PCB Chat 88: HDP Users Group Update

PCB Chat 88: HDP Users Group Update

December 1, 2021

Larry Marcanti, executive director of the High Density Packaging User Group (HDP), and Madan Jagernauth, marketing director and project facilitator, talk with Mike Buetow about the trade consortium's recent semiannual meeting and its recently finished projects, including one for SIR.

HDP  (hdpusergroup.org) is a consortium of more than 50 global companies that conceives and runs projects on electronics packaging and reliability. It has completed more than 50 such projects over the course of its 25 years. 

 

C2C 12: Smart Splice Cofounder Larry Welk

C2C 12: Smart Splice Cofounder Larry Welk

December 1, 2021

Larry Welk is co-owner of Smart Splice. Larry is a business owner with a history of working in the electrical and electronic manufacturing industry. Skilled in sales, business management, business development, business process improvement, and sales management, Larry says he obtained a Master's degree from the school of hard knocks. After getting knocked down, he says he always focused on learning and getting back up again, a valuable lesson we can all learn from!

Mike Konrad talks to Larry about his “up and down” journey and learn what knocked him down and, more importantly, what his inspiration and techniques were to get back up again.

 

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