Recorded conversations and interviews on electronics design and manufacturing with the editors of PCD&F/Circuits Assembly, brought to you by the Printed Circuit Engineering Association (PCEA)
Episodes
Friday Jul 21, 2023
Friday Jul 21, 2023
Thermal interface materials are used for heat transfer in a variety of electronics applications.
On this episode of PCB Chat, Claire Wemp, Ph.D, a thermal applications engineer at DuPont, discusses TIM1 materials (and explains the difference between TIM1 and TIM2), when and where they are used, who specifies them, and how they work.
Wemp is also a member of the Society Women in Electronics, and in the second half of the podcast we talk about her experience in SWE, which dates to college, DuPont's role in recruiting, and how to bend the curve in attracting more women to STEM fields.
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