Recorded conversations and interviews on electronics design and manufacturing with the editors of PCD&F/Circuits Assembly, brought to you by the Printed Circuit Engineering Association (PCEA)
Episodes
Wednesday Dec 01, 2021
Wednesday Dec 01, 2021
Larry Marcanti, executive director of the High Density Packaging User Group (HDP), and Madan Jagernauth, marketing director and project facilitator, talk with Mike Buetow about the trade consortium's recent semiannual meeting and its recently finished projects, including one for SIR.
HDP (hdpusergroup.org) is a consortium of more than 50 global companies that conceives and runs projects on electronics packaging and reliability. It has completed more than 50 such projects over the course of its 25 years.
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