Recorded conversations and interviews on electronics design and manufacturing with the editors of PCD&F/Circuits Assembly, brought to you by the Printed Circuit Engineering Association (PCEA)
Episodes
Wednesday May 18, 2022
Wednesday May 18, 2022
Cadence and Dassault Systèmes in late February announced the combining of the former's Allegro platform with the latter's 3DExperience platform in a joint solution that enables customers to perform multidiscipline modeling, simulation and optimization of complex, connected electronic systems. The firms say this new multidisciplinary approach can accelerate customers’ end-to-end system development process while optimizing their design for performance, reliability, manufacturability, supply resilience, compliance and cost.
Today’s guests are Stéphane Declée, CEO of the Dassault Systèmes ENOVIA brand, and Michael Jackson, corporate vice president of R&D at Cadence's System, Package, Board Group.
They address a range of topics related to the integration, including how this could help users working in both environments, the manufacturing elements that can now be simulated, the functionality updates, and how other partnerships with ECAD and MCAD providers will be affected.
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