
Recorded conversations and interviews on electronics design and manufacturing with the editors of PCD&F/Circuits Assembly, brought to you by the Printed Circuit Engineering Association (PCEA)
Recorded conversations and interviews on electronics design and manufacturing with the editors of PCD&F/Circuits Assembly, brought to you by the Printed Circuit Engineering Association (PCEA)
Episodes

Wednesday Apr 12, 2023
RM 117: When Residues Cause Circuit Assemblies to Fail
Wednesday Apr 12, 2023
Wednesday Apr 12, 2023
Eric Camden (lead investigator with Foresite) and Mike Konrad discuss electrochemical migration (ECM) and other failure modes caused by residues on circuit assemblies.
Version: 20241125

No comments yet. Be the first to say something!