Recorded conversations and interviews on electronics design and manufacturing with the editors of PCD&F/Circuits Assembly, brought to you by the Printed Circuit Engineering Association (PCEA)
Episodes
Thursday Jun 30, 2022
Thursday Jun 30, 2022
Jen Fijalkowski works for Aim Solder. Jen obtained her B.S. from the University of Rhode Island in chemical engineering and is a certified Lean Six Sigma Green Belt. Prior to her role as a technical marketing engineer, she interned as a SMT Process Engineer, where she analyzed various reports regarding solder paste printing and coauthored "Comparison of Aperture Designs, Solder Pastes, Nanocoatings and Print/Inspection Systems," published in PCD&F/Circuits Assembly. Jen also produces a video blog titled “Line Down” where she discusses common questions about solder paste best practices and how to avoid solder paste induced line-down situations.
Mike Konrad spoke with Jen about solder paste best practices as well as some of the latest advances in solder pastes such as low temperature, low voiding, and high reliability solder pastes.
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