Recorded conversations and interviews on electronics design and manufacturing with the editors of PCD&F/Circuits Assembly, brought to you by the Printed Circuit Engineering Association (PCEA)
Episodes
Tuesday Jul 12, 2022
Tuesday Jul 12, 2022
In late 2018, IPC shocked the electronics assembly community by introducing an amendment to section 8 of the J-STD-001G. This amendment radically changed the way industry determines cleanliness. Now, assemblers must prove their assemblies are clean enough not to experience electrochemical migration events which would cause the assembly to fail.
This new process of obtaining objective evidence has been met with a considerable degree of confusion. To help clear up the confusion, Mike Konrad speaks with Graham Naisbitt, vice chair of the IPC 5-30 Cleaning and Coating Subcommittee that oversees 15 IPC Standards Development Committees and recipient of 14 IPC Standards Awards.
Naisbitt is an IEC 1906 Lord Kelvin Award Winner, IEC TC91 WG2, 3 and 10 Maintenance Leader of 4 Standards, and a British Standards Institution EPL-501 Member.
He is a specialist in surface insulation resistance testing, ionic contamination control, solderability, conformal coating materials and application systems, cleaning, inspection and test.
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