Syrma Technology is one of India’s largest domestically based EMS companies. Its chief executive, Sreeram Srinivasan, was educated in both India and the United States, returning to India after research stints in Los Alamos and Oak Ridge National Labs. There, he has held a variety of management jobs in the automotive and industrial sectors. He became CEO of Syrma in 2015. He speaks with PCB Chat host Mike Buetow about his company's place in the EMS sector, its growth plans, and his experiences doing business in the Indian electronics market.
This week’s guest on PCB Chat is Sue Mucha, president of Powell-Mucha Consulting, an EMS business consulting firm. In the wake of the Covid-19 (coronavirus), she outlines strategies for communicating possible or actual supply chain and factory disruptions to suppliers, employees and customers.
Also see Sue's recent column on this topic at circuitsassembly.com.
Dr. Darren Williams, professor at Sam Houston University, discusses cleaning processes and materials and the upcoming Product Quality Cleaning workshop with host Mike Konrad.
Barbara and Ed Kanegsberg about all things cleaning. Barbara and Ed are the authors of Handbook for Critical Cleaning (available here). They discuss their upcoming Product Quality Cleaning Workshop, in cooperation with Sam Houston State University in Huntsville, TX, and Dr. Darren Williams on May 13-14. For more information, click here.
Chris Nash is product manager for Indium’s PCB assembly solder paste, where works with the R&D team and provides technical advice in the selection, use, and application of solder paste and flux to electronics assembly customers throughout the world. He is also a certified Six Sigma Green Belt from Dartmouth College’s Thayer School of Engineering and a Certified SMT Process Engineer. He talks about solder paste insufficients caused by printing with PCB Chat host Mike Buetow.
In this episode, George Milad, national accounts manager of technology at Uyemura and co-chair of the IPC Plating Processes Subcommittee, explains nickel corrosion, how it occurs and new methods of mitigation, and how the IPC-4552 ENIG specification is being revised to reflect new corrosion analysis requirements. Hosted by Mike Buetow.
Reliability Matters: Episode Episode 32: A Conversation with Greg Smith and Tony Lentz about Stencil Design and Void Reduction
Greg Smith and Tony Lentz talk with Mike Konrad about stencil design and how to reduce voiding. Voiding is a key concern in specific electronic applications including automotive and LED electronic manufacturing. Greg and Tony published a paper titled "Root Cause Stencil Design for SMT Component Thermal Lands," which is available here: https://tinyurl.com/szx3xt8.
Wally Rhines, CEO emeritus of Mentor and former chairman of the ESD Alliance, reports on the third quarter 2019 EDA market results with PCB Chat host Mike Buetow.
Heller Industries CEO David Heller joined the family business in 1987, 27 years after its founding. David shares what reflow ovens were like at the beginning stages of surface mount technology and the numerous technological changes required along the way with Reliability Matters host Mike Konrad.
In the second of this two-part interview, Mike Konrad talks with IPC's Brooke Sandy about the IPC Apex Expo technical program.