PCB Chat
Reliability Matters Episode 27: A Conversation with IPC’s Brook Sandy about IPC Apex Expo (Part 1)

Reliability Matters Episode 27: A Conversation with IPC’s Brook Sandy about IPC Apex Expo (Part 1)

October 29, 2019

In the first of two episodes, Mike Konrad interviews IPC technical program manager Brook Sandy about the upcoming IPC Apex Expo. Episode 27 is all about Apex in general, including the technical sessions and keynote speakers.

 

Reliability Matters: Episode 26 - Alun Morgan of Ventec

Reliability Matters: Episode 26 - Alun Morgan of Ventec

October 22, 2019

Alun Morgan and Mike Konrad talk cars, and the increased reliability expectations associated with their electrical systems. The electronics in modern vehicles provide an unpresented level of safety, not just for the driver, but for those people and objects around the vehicle. Because our cars go in and out of harsh environments, the circuit assemblies within the car are subjected to heat, humidity (and other sources of moisture), which contribute to reliability and therefore safety. They discuss one of the primary failure mechanisms of circuit assemblies, an issue that can affect the operation of the safety systems within the automobile, it’s a real issue that for many is not well known.

PCB Chat Episode 48: Dr. Puneet Gupta of UCLA

PCB Chat Episode 48: Dr. Puneet Gupta of UCLA

October 14, 2019

According to Puneet Gupta, Ph.D. and his colleagues at UCLA including Subramanian Iyer, Ph.D., the printed circuit board is a constraint on electronics size and speed. And the solution is to get rid of it. The professors have developed a method to replace PCBs with an all-silicon technology, called silicon-interconnect fabric, which allows bare chips to be connected directly to wiring on a separate piece of silicon. The wiring between chips on fabric is at the nanometer scale, much like the wiring within a chip. Dr. Gupta asserts many more chip-to-chip connections are thus possible, and those connections are able to transmit data faster while using less energy. He discusses the technology and its implications with PCB Chat host Mike Buetow.

Reliability Matters: Episode 25: An Interview with Indium’s Kay Parker

Reliability Matters: Episode 25: An Interview with Indium’s Kay Parker

October 8, 2019

Indium's Kay Parker discusses SMT solder paste printing and her experience as a new engineer in the electronics assembly industry with Mike Konrad.

Kay is a technical support engineer based at Indium headquarters in Clinton, NY. In this role, she provides guidance and recommendations to customers related to process steps, equipment, techniques, and materials. She is also responsible for servicing the company’s existing accounts and retaining new business. She joined Indium as a college intern. During her internship, she worked alongside process engineers in Indium's Metals and Compounds division. After graduating from the State University of New York Polytechnic Institute in 2018, Kay joined the company as a technical support engineer.

At SUNY Poly, Kay earned a bachelor’s degree in applied mathematics with a minor in engineering science. Her past accomplishments include managing the details of a National Science Foundation grant, forming and leading an award-winning competitive student robotics club, developing industrial manufacturing process technologies, and modeling the flow of blood in the human eye using mathematical equations and computer programs.

PCB Chat Episode 47: Hemant Shah of Cadence

PCB Chat Episode 47: Hemant Shah of Cadence

October 2, 2019

Hemant Shah of Cadence joins PCB Chat host Mike Buetow to discuss the latest upgrades to the Allegro ECAD tool, including new features for signal integrity and power integrity (SI/PI).