Mark Finstad is senior application engineer for Flexible Circuit Technologies. He has over 30 years of experience designing and manufacturing flexible circuits for commercial, medical, and military/avionics applications. He co-chairs the IPC-2223 Design Standard for Flexible Printed boards and coauthors the Ask the Flexperts column for PCD&F magazine.
Nick Koop is a senior field application engineer for TTM Technologies and has over 30 years of design, manufacturing and management experience in the flexible circuit industry. He developed and applied advanced PCB technologies to support a wide range medical, military, and global security applications. He is vice chairman of the IPC Flexible Circuits Committee, co-chair for the IPC-6013 Qualification and Performance Specification for Flexible Printed Boards Subcommittee, and coauthors the Ask the Flexperts column for PCD&F magazine.
They discuss real-life flex circuit struggles and how to overcome them with PCB Chat's Mike Buetow.