With the rapid expansion of IOT, many circuit assemblies are now functioning in unfamiliar environments, many of these environments are harsh. Additionally, many new electronic applications control critical systems such as automotive electronics. This webinar focuses on the influence contamination plays on reliability of circuit assemblies, particularly when operated in harsh environments.
Several contamination-related failure mechanisms are presented including electrochemical migration (dendritic growth, parasitic leakage) and conductive anodic filament (CAF). Methods to determine how clean is clean enough are discussed.