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RM 56: A Conversation about Solder Voiding with Solder Materials, Stencil, and Cleaning Experts

December 2, 2020

Voiding is the cause of multiple failure mechanisms. Mike Konrad speaks with solder material expert Tim O'Neill of Aim Solder, stencil manufacturer Prakash Gango of StenTech, and cleaning materials manufacturer Kalyan Nukala of Zestron about how solder voiding leads to product failures and methods to reduce voiding.

 

The guests may be reached here:

Tim O'Neill

AIM Solder

toneill@aimsolder.com

www.aimsolder.com

 

Prakash Gango

StenTech

prakash@stentech.com

www.stentech.com

 

Kalyan Nukala

Kalyan.Nukala@zestronusa.com

www.zestron.com

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