On this episode, we’ll have a conversation with two industry experts on the subject of solder voiding mitigation and oven profiling, two subjects which influence solder voiding. This will be a two part episode. Here, we dive into void mitigation and how vacuum reflow technology can help reduce or eliminate voiding. Part two (episode 65) will discuss profiling best practices.
Our guests are Tim O’Neill from AIM Solder and Fred Dimock of BTU. Tim will discuss voiding mitigation from a materials standpoint while Fred will bring cover equipment and profiling strategies.
Tim O'Neill is technical marketing manager for AIM Solder. Operating out of AIM’s US headquarters, Tim is responsible for developing and optimizing product and technical information, collaborating with complementary suppliers and equipment manufacturers and ensuring AIM's products exceed expectations and meet market requirements.
Tim is also a technical writer and presenter for industry trade publications and events. He has coauthored several papers on PCB assembly subjects. Tim is also an IPC-A-610 Certified IPC Specialist.
Fred Dimock is manager of process technology at BTU International and recently started a consulting business, FCD-Global services. Fred holds an associate degree in mechanical design from Wentworth in Boston and a bachelor's degree in ceramic engineering from the State University of New York. He has authored numerous articles on lead-free solder, process control, and the operation of continuous furnaces. His papers have been published in English, Chinese, and German.
He has taught numerous SMTA solder reflow classes and participated in the 5-45 Subcommittee for the development of IPC-7801 Reflow Oven Process Control Standard. Additionally, he wrote the chapter on solder reflow for the Handbook of Electronic Assembly and A Guide to SMTA Certification by Dr. Ron Lasky and Jim Hall.
He received Distinguished Speaker status at SMTA Guadalajara Mexico and is a key presenter for the SMTA Jump Start program for new engineers.