PCB Chat

RM 160: Opportunities and Challenges within the EV Industry

Today, we’re diving into one of the most transformative innovations of our time: electric vehicles and the vast infrastructure needed to support their growth. 

Joining host Mike Konrad is Brian O’Leary, global head of of e-Mobility & Infrastructure at Indium Corporation, a leading expert with deep insights into the electronic assembly industry and its critical role in the EV revolution.

As electric vehicles continue to redefine the future of transportation, the reliability and scalability of the infrastructure that powers them—particularly public EV charging stations—have become pivotal challenges. 

The electronics assembly industry is at the heart of these systems, from the semiconductors enabling fast charging to the sensors ensuring safe and efficient operation. However, with nearly 26% of public EV charging stations estimated to be nonfunctional at any given time, reliability remains a significant hurdle.

This episode will explore the major reliability issues plaguing public EV charging stations, including power instability, component failures, and environmental challenges. How innovations in electronics design and assembly can address these challenges, from improving thermal management to leveraging advanced materials like those developed by soldering materials manufacturers.

The exciting opportunities for the electronics industry to lead the charge in building a more resilient, reliable, and efficient EV infrastructure.

Brian O’Leary brings a wealth of knowledge on how advanced materials, smart assembly techniques, and innovative designs can solve these pressing issues and accelerate the adoption of electric vehicles. 

Together, we’ll review the technical challenges, explore solutions, and look ahead to the bright future of electric mobility.

Chapters:

00:00:00 The Future of Transportation with Electric Vehicles

00:02:48 Fascination with Electric Vehicles 

00:06:03 The Dilemma of Electric Vehicles: A Personal Story 

00:09:12 Global Automotive Industry Trends 

00:12:22 The Simplicity of EV Design vs. Combustion Engines 

00:15:25 Notorious Tech Launch Strategies 

00:18:22 Stress on Electric Vehicle Components

00:21:34 Differences in EV Charging Technology

00:24:23 Optimal Conditions for EV Battery Performance

00:27:15 Safety Debate: Lithium-ion Batteries vs. Gasoline Engines

00:30:28 The Evolution of Safer Battery Chemistries

00:33:45 Challenges with EV Charging Infrastructure

00:37:22 EV Charging Station Failures: Understanding the 26% Rate

00:40:30 Environmental Challenges for Electronics in Unusual Locations

00:43:32 Quality Control in Electronics Manufacturing 

00:46:29 Tesla Charging Stations: Reliability and Self-Reporting 

00:49:30 Challenges with Remote EV Charging Stations 

00:52:35 Adoption of Tesla's Charging Standard in North America

00:55:41 Evolution of High-Reliability Alloys in Automotive

00:58:44 The Future of Autonomous Vehicles in Traffic Management

01:01:39 Future of Autonomous Transportation

01:04:42 Localization Trends in EV Manufacturing

01:07:43 The Promise of Flying Cars and Exponential Tech Growth

01:10:36 Introduction to Reliability Matters Podcast

PCB Chat 139: PCB Design Software Market Analysis with Wally Rhines

Sales of software for printed circuit board and multichip module design rose to a record $450 million in the third quarter ended in October, extending a growth streak that has seen only three down quarters in the past nine years, the ESD Alliance announced today.

Our guest Wally Rhines offers the latest data and analysis of the electronic design market, which saw strength in the Americas and Europe offsetting dips in Asia and Japan. He also offers comments on how the latest merger announcements (Synopsys-Ansys, Renesas-Altium, Siemens-Altair) might impact the data trends. And he discusses how funds from the Chips Act may (or may not) show up in future EDA sales. 

PCB Chat 138: A Look at PCB Industry Legislation in 2025 with David Schild of the PCBAA

Questions about over how the new administration and Congress coming in January will approach government investment in capital projects, workforce development and other incentives to build back the domestic electronics supply chain.

David Schild, executive director of the Printed Circuit Board Association of America, joins Mike Buetow to discuss what the expected priorities of the incoming administration, how they align with the goals of PCBAA’s members, their strategy for continuing the progress on tax benefits and other financial incentives within the US Congress, and the need for a bipartisan approach for global industrial policy.

RM 158: D-Code Podcast Interview

The hosts of the D-Code podcast are a dynamic trio of young professionals making waves in the electronics manufacturing industry. 

With experience rooted in contract manufacturing and stencil fabrication for electronics assemblies, they bring a fresh perspective to the table. Although they’re at the start of their podcasting journey, D-Code has already begun to attract attention, tackling industry insights with a unique lens that up-and-coming voices can uniquely offer. 

Mike Konrad's guests are Daniel Stanphill, SMT process engineer at Aurora Boardworks, a contract assembler located in Aurora, Nebraska; Sean Kincaid, president of K & F Electronics, located in Fraser, Michigan, also a contract manufacturer; and Elias Malfavon, president of Metal Etch Services, a SMT stencil fabricator located in San Marcos, California.

Mike asks them about their experiences, challenges, and how they’re setting out to decode the world of electronics manufacturing.

Chapters:

00:00:00 Introducing the Hosts of Decode Podcast

00:02:37 Key Factors in Choosing a Contract Manufacturer

00:05:53 Evolution of Contract Manufacturers

 

00:06:20

00:08:03 Evolution of Manufacturing Technology and Job Dynamics

00:10:34 Challenges with Stencil Rigidity 

00:13:19 Challenges in Contract Manufacturing for High-Requirement Industries 

00:15:57 Advanced Techniques in Moisture Sensitive Electronics

00:18:31 Advantages of Board Fabrication and Design Knowledge in Contract Assembly

00:21:18 Improving PCB Design for Manufacturing Efficiency

00:24:04 Overcoming Manufacturing Challenges with PCB Finishes

00:26:52 Debate on Gloss vs. Matte in PCB Soldering

00:29:31 Advances in SMT Stencil Materials and Technologies

00:32:26 The Challenges of Stencil Printing 

00:35:15 The Idea Behind the Podcast 

00:37:42 Insights from PCB Manufacturing Experts

00:40:19 Collaborating in Competitive Spaces 

00:42:54 Starting a Podcast: Challenges and Solutions

00:45:38 Overcoming Podcast Challenges 

00:48:26 The Shift from In-Person Networking to Digital Collaboration

00:51:18 The Evolution of Networking and Conferences 

00:54:05 Career Opportunities in Engineering 

00:56:37 The Value of IPC Certifications in SMT Production

00:59:37 Influencers in the Electronic Assembly Industry

01:02:12 How to Engage with Reliability Matters Podcast

 

 

RM 156: An Introduction to Flexible Circuits with Joseph Fjelstad

On today’s episode, we’re turning our focus to a pivotal innovation that has transformed design and manufacturing processes: flexible circuits.

Flexible circuits have emerged as a game-changer in the manufacturing and design of electronic assemblies. With their unique ability to bend, twist, and conform to complex shapes, they offer unparalleled advantages in applications where space is at a premium and reliability is paramount. 

From wearable technology and medical devices to aerospace systems and consumer electronics, the use of flexible circuits has expanded rapidly, bringing with it both opportunities and challenges.

In this episode, we’ll explore the evolution of flexible circuit technology, discussing its key benefits, such as lightweight construction, enhanced durability, and improved design freedom. 

We’ll also touch on the manufacturing complexities, material considerations, and the critical role that process control plays in ensuring reliability and performance.

Mike Konrad's guest today is Joseph Fjelstad. Joe is the founder of Verdant Electronics. Joseph Fjelstad has been active in electronics manufacturing since 1972 in various roles, including as a chemist, process engineer, and R&D manager. He holds nearly 190 US patents and numerous foreign ones. 

He is an internationally recognized expert, inventor and lecturer in the field of electronics interconnection technology and a veteran of several startup companies, including: Beta Phase, ELF Technologies, MetaRAM, Silicon Pipe, and Tessera (now the public company, Xperi).

Some of Joe’s innovative devices and novel reliability improving IC packaging structural features are found in nearly every electronic device made today. 

He is also an author, co-author or editor of several books on interconnection technology, including Flexible Circuit Technology 4th Edition, the most widely distributed reference book on the topic, Chip Scale Packaging for Modern Electronics, and Solderless Assembly For Electronics — The SAFE Approach. 

In addition, Fjelstad has written hundreds of articles, columns and commentaries for various industry magazines and journals over the last five decades. And today, he’s the guest on my show.

00:00:00 Importance of Flexible Circuits in Modern Electronics  
00:02:42 Exploring the World of Flexible Circuits  
00:05:30 Introduction to Flexible Circuits: A Historical Perspective
00:08:43 Entrepreneurship Mindset: Naivety and Innovation
00:11:08 The Value of Naivety in Engineering  
00:13:43 Innovations in Bubble Printing Technology  
00:16:47 Understanding Flex Circuits: Applications and Challenges
00:19:58 The Lifespan and Failure of Torsion Bars  
00:22:21 Evolution of Soldier Technology: From Heads-Up Displays to Wearables
00:25:24 The Origins of the Integrated Circuit
00:28:13 Advances in Microelectronics: From Printed Transistors to Modern Tech
00:31:28 Challenges and Solutions in Flexible Circuit Design
00:34:00 Collaborative Design for Efficient Manufacturing  
00:36:49 Advances in Flexible HDI and the Upcoming Ultra HDI Conference  
00:39:46 Evolution of Flexible Circuits: From 1903 to Present   
00:42:40 Innovating Flexible Circuits  
00:45:13 Evolution of Toll Road Technology
00:48:08 The Future of Flexible and Stretchable Circuits
00:51:53 Introduction to Verdant Electronics  
00:54:46 The Military's Stance on Lead-Free Technology  
00:56:27 Innovating Solderless Technology
00:59:18 Insights on Persistence and Success in Entrepreneurship

RM 155: Ultra HDI Panel Discussion - Recorded Live at SMTAI

Today's podcast comes from the Surface Mount Technology Association SMTAI trade show.

 
As the demand for smaller, faster, and more powerful devices grows, the need for innovative solutions in circuit design has never been greater. UHDI's represent a significant leap forward, allowing for more connections in a smaller space, pushing the boundaries of what's possible in electronic assemblies.

But what exactly are ultra-high-density interconnects? Essentially, they refer to circuit boards with incredibly fine pitch interconnects, enabling higher functionality and complexity in much smaller form factors. 

This breakthrough is transforming industries like consumer electronics, aerospace, automotive, and medical devices, where space, weight, and performance are critical factors.

In this episode, we’ll explore the advantages UHDI's bring to the table, from increased design flexibility and performance to better thermal management. We'll also discuss how UHDI's are set to impact the assembly process. With tighter tolerances and more intricate layouts, UHDI assemblies will require new approaches to assembly, inspection, and reliability testing.

To better explain UHDI technology, we’ve put together a panel of subject matter experts. Tara Dunn, director of training and education at SMTA, will moderate a panel discussion with other subject matter experts, including Anaya Vardya, CEO, of American Standard Circuits; Chrys Shea from Shea Engineering Services; Michael Sivigny, owner and general manager of CeTaQ Americas; and Oren Manor, Op-Center core program business director at Siemens Digital Industries Software.

UHDI is here! And if you haven’t seen it on your assembly line yet, it’s coming, so stay tuned as we unpack the future of ultra-high-density interconnects and what it means for the next generation of technology.

RM 154: Thermal Profiling Best Practices

One of the most critical aspects of manufacturing high-reliability circuit assemblies is thermal profiling during the reflow process. 

Whether you're designing, engineering, or troubleshooting circuit assemblies, understanding how temperatures during the reflow process influences the quality and performance of your assemblies is essential. 

In this episode, we’ll break down what thermal profiling is, why it’s important, and how it affects everything from solder joint integrity to component placement. 

We’ll also explore the challenges and solutions involved in getting your thermal profile just right, ensuring your circuit assemblies are built to last in a competitive and demanding industry.  And we review thermal profiling best practices, common mistakes, and the various capabilities of thermal profilers.

Mike Konrad's guest is Mark Waterman. Waterman is the Electronics division manager at ECD, a manufacturer of thermal profiling equipment founded in 1964. He began his career at ECD in 2006.

Chapters:

00:00:00 Understanding Thermal Profiling in Circuit Assemblies 

00:05:19 Evolution of a Manufacturing Business 

00:08:00 Understanding Thermal Profiling in Electronics Soldering

00:10:36 Strategies for Circuit Assembly Insulation 

00:13:10 Challenges in Sourcing Obsolete Electronic Components

00:15:48 Challenges in Heat Dissipation for 5G and 6G Electronics

00:18:54 Choosing the Right Thermocouple: K Type vs. Others

00:21:35 Challenges with High-Temperature Materials

00:24:04 Determining Thermal Couples for Optimal Measurement

00:26:39 Innovations in Profiling Equipment Technology

00:29:24 Innovations in Display Screens and Risk Mitigation

00:31:55 Cost-Benefit Analysis of Data Loggers 

00:34:31 Importance of Calibration Intervals in Industry 

00:37:02 The Role of Data Logging in Thermal Profiling

00:39:30 Optimizing Reflow Oven Settings with Predictive Software

00:42:18 Easy Button vs. Detailed Work: Software Development Insights

00:45:20 Common Mistakes in Using Thermal Profilers 

00:47:37 Optimizing Thermocouple Measurements in Electronics 

00:50:08 Understanding Thermal Barriers and Heat Management

00:52:22 Understanding Thermal Dissipation Challenges

00:54:59 The Importance of Third-Party Auditors in Manufacturing

00:57:32 Insights on Thermal Profiling and Bespoke Solutions

00:59:54 Podcast Contact and Closing Remarks

 

RM 153: Contract Manufacturing Best Practices with Adrian Leal

If you're part of the electronics landscape, you've likely encountered the role contract manufacturers play — and it's a critical one. These specialized partners bridge the gap between design innovation and full-scale production, bringing efficiency, expertise, and flexibility to the table.

As companies seek to meet growing demand for advanced electronic products, contract manufacturers are increasingly relied upon to provide cost-effective, high-quality assembly services. Whether it's managing supply chains, ensuring compliance with industry standards, or accelerating time to market, their contributions have become indispensable. In today's episode, Mike Konrad explores how contract manufacturing works, why it's so vital, and what trends are shaping the future of this essential industry.

Adrian Leal serves as USA business development manager for Teltonika EMS and is president of the Houston SMTA Chapter. With over 30 years of experience in the manufacturing industry, he has worked extensively as both an end-user and a service provider. Throughout his career, he has held diverse roles including process engineer, manufacturing engineer, quality engineer, field engineer, and sales engineer.

In 2003, Leal became the first engineer from the oil and gas industry to earn the prestigious Process Engineer certification from the SMTA. From 2006 to 2015, he voluntarily took on the role of ESD Subject Matter Expert for SLB, where he developed an internal ESD program that remains in use today.

Leal talks about his transition from an OEM to a contract manufacturer and recommendations on how to choose the most appropriate contract manufacturer.

PCB Chat 137: The Q2 PCB Design Software Market

Sales of software for printed circuit board and multichip module design surged 8.2% to $399 million in the second quarter ended in July, continuing a long recovery, the ESD Alliance announced today.

Our guest Wally Rhines offers his typical informed assessment of the latest market numbers, noting the particular strength in core areas such as analysis and library data management tools. And he discusses how the rapid rise of EDA startups today compares to a similar upswing in the 1980s. 

 

 

 

PCB Chat 136: Jim Rathburn on UDHI Using LCPs

Jim Rathburn may not be a household name in the printed circuit industry, but maybe he should be. A self-styled serial technologist and innovator, Rathburn holds more than 80 patents covering the gamut of high-density printed circuits, materials and semiconductors.

As founder and president of Precision Circuit Technologies, Rathburn helps commercialize the Minneapolis area company’s high-performance, high-density printed circuits, electrical interconnects, and advanced materials for the next generation of semiconductors, electronics, and systems.

He discusses PCT's technologies, in particular with liquid crystal polymer, and its use of both additive and conventional processes to build lines and spaces down to 6 microns. He also details PCT's zero-discharge processing, and licensing approach.